1 Wroclaw University of Technology, Faculty Chemical Technology, Specialization: design of technological processes and production quality. Research conducted at Universal Scientific Industrial Poland Ltd.
2 Wroclaw University of Technology, Faculty of Automation and robotics, Specialization: Robotics. Research conducted at Universal Scientific Industrial Poland Ltd.
World Journal of Advanced Engineering Technology and Sciences, 2025, 15(03), 412–423
Article DOI: 10.30574/wjaets.2025.15.3.0759
Received on 07 April 2025; revised on 01 June 2025; accepted on 04 June 2025
This paper presents an analysis of the influence of selected parameters of the wire bonding process on the occurrence of lift-off defects using the Design of Experiments (DOE) methodology. A structured experimental plan was used to evaluate the effect of key process factors, including ultrasonic power, bonding time, and bond force. Statistical analysis was performed to identify significant variables and optimize the process parameters. The results indicate specific interactions between variables that contribute to the minimization of lift-off defects, thus enhancing bond quality and production yield.
Wire bonding; DOE; Lift-off defect; Process optimization; Statistical analysis
Preview Article PDF
Katarzyna Dymek and Piotr Hebel. Validation of the solder paste imprinting process: KOKI S3X58-M650-7 based on an experiment conducted with the use of the DoE methodology. World Journal of Advanced Engineering Technology and Sciences, 2025, 15(03), 412–423. Article DOI: https://doi.org/10.30574/wjaets.2025.15.3.0759.