Optimization of SMT process parameter for yield improvement of PCBS
BEL Panchkula, Haryana, India.
Research Article
World Journal of Advanced Engineering Technology and Sciences, 2022, 07(02), 079-086.
Article DOI: 10.30574/wjaets.2022.7.2.0131
Publication history:
Received on 12 October 2022; revised on 22 November 2022; accepted on 24 November 2022
Abstract:
The manufacturing process of Electronics Assembly has undergone a sea changes. Component industry has migrated to surface mounted devices from through whole components. This change has resulted into miniaturization of the equipment as well as pushed entire assembly operation to automatic process. Thus correct setting of process parameter is essential to maintain quality and throughput of the entire process. Process parameter need to be set as accurate as possible, so that there is no possibility any rejection.
Keywords:
Surface mounted technology; Digital Voice and Video Recorder; Printed circuit board; Automatic Optical Inspection.
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Copyright © 2022 Author(s) retain the copyright of this article. This article is published under the terms of the Creative Commons Attribution Liscense 4.0